US Patent Issued to Applied Materials on Jan. 28 for "Spatial pattern loading measurement with imaging metrology" (California Inventors)

ALEXANDRIA, Va., Jan. 29 -- United States Patent no. 12,211,717, issued on Jan. 28, was assigned to Applied Materials Inc. (Santa Clara, Calif.).

"Spatial pattern loading measurement with imaging metrology" was invented by Eric Chin Hong Ng (Milpitas, Calif.), Edward Wibowo Budiarto (Fremont, Calif.), Mehdi Vaez-Iravani (Los Gatos, Calif.), Todd Jonathan Egan (Fremont, Calif.) and Venkatakaushik Voleti (Cupertino, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method includes identifying first structure data of a first region of a substrate and receiving optical metrology data of the substrate associated with one or more substrate deposition processes in a processing chamber. The method further incl...