US Patent Issued to Applied Materials on Jan. 28 for "Method of forming a metal liner for interconnect structures" (California Inventors)

ALEXANDRIA, Va., Jan. 29 -- United States Patent no. 12,211,743, issued on Jan. 28, was assigned to Applied Materials Inc. (Santa Clara, Calif.).

"Method of forming a metal liner for interconnect structures" was invented by Ge Qu (Sunnyvale, Calif.), Zhiyuan Wu (San Jose, Calif.), Feng Chen (San Jose, Calif.), Carmen Leal Cervantes (Mountain View, Calif.), Yong Jin Kim (Albany, Calif.), Kevin Kashefi (San Ramon, Calif.), Xianmin Tang (San Jose, Calif.), Wenjing Xu (San Jose, Calif.), Lu Chen (Cupertino, Calif.) and Tae Hong Ha (San Jose, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Methods of forming devices comprise forming a dielectric layer on a substrate, the dielectric layer comprising at least...