US Patent Issued to Applied Materials on Jan. 27 for "Substrate support assembly with dieletric cooling plate" (California Inventor)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,537,464, issued on Jan. 27, was assigned to Applied Materials Inc. (Santa Clara, Calif.).

"Substrate support assembly with dieletric cooling plate" was invented by Arvinder Manmohan Singh Chadha (San Jose, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate support assembly includes a first puck plate including one or more first functional elements, and a dielectric cooling plate is bonded to the first puck plate. The dielectric cooling plate includes one or more first channels for a coolant to flow therethrough, and one or more second channels for a gas to flow therethrough."

The patent was filed on Oct. 6, 2023, under Application No. 18...