ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,533,704, issued on Jan. 27, was assigned to Applied Materials Inc. (Santa Clara, Calif.).
"Substrate carrier improvement" was invented by Russell Chin Yee Teo (Palo Alto, Calif.), Yingdong Luo (Newark, Calif.), Ludovic Godet (Sunnyvale, Calif.), Daihua Zhang (Los Altos, Calif.), Zhengping Yao (Cupertino, Calif.) and James D. Strassner (Austin, Texas).
According to the abstract* released by the U.S. Patent & Trademark Office: "A method of forming a substrate carrier is provided. The method includes forming a first electrode over a first surface of a substrate, the first electrode arranged in a first pattern including a plurality of segments, wherein portions of the plurality of segmen...