US Patent Issued to Applied Materials on Jan. 27 for "Polishing slurry dispense nozzle" (California Inventors)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,533,771, issued on Jan. 27, was assigned to Applied Materials Inc. (Santa Clara, Calif.).

"Polishing slurry dispense nozzle" was invented by Chih Chung Chou (San Jose, Calif.), Anand Nilakantan Iyer (Cupertino, Calif.), Ekaterina A. Mikhaylichenko (San Jose, Calif.), Christopher HeungGyun Lee (San Jose, Calif.) and Shou-Sung Chang (Mountain View, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Exemplary slurry delivery systems may include a slurry source. The systems may include a slurry line coupled with the slurry source. The systems may include a slurry dispensing nozzle. The nozzle may include a lumen having an inlet that is fluidly coupled wi...