US Patent Issued to Applied Materials on Jan. 13 for "Underlayer topography metal residue detection and overpolishing strategy" (California Inventors)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,521,837, issued on Jan. 13, was assigned to Applied Materials Inc. (Santa Clara, Calif.).

"Underlayer topography metal residue detection and overpolishing strategy" was invented by Kun Xu (Fremont, Calif.) and Harry Q. Lee (Los Altos, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "An apparatus for processing a substrate, the apparatus comprising a polishing assembly and a controller. The polishing assembly is configured to (a) polish a surface of the substrate. The controller is configured to (b) detect a first substrate measurement corresponding to a first region of the substrate, (c) detect a second substrate measurement corresponding to a seco...