US Patent Issued to Applied Materials on Jan. 13 for "Method and apparatus to reduce feature charging in plasma processing chamber" (California Inventors)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,525,433, issued on Jan. 13, was assigned to Applied Materials Inc. (Santa Clara, Calif.).

"Method and apparatus to reduce feature charging in plasma processing chamber" was invented by Linying Cui (Cupertino, Calif.), James Rogers (Los Gatos, Calif.), Rajinder Dhindsa (Pleasanton, Calif.) and Kartik Ramaswamy (San Jose, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments provided herein include an apparatus and methods for the plasma processing of a substrate in a processing chamber. In some embodiments, aspects of the apparatus and methods are directed to reducing defectivity in features formed on the surface of the substrate, improving p...