US Patent Issued to Applied Materials on Jan. 13 for "High bandwidth density optical interfaces for co-packaged devices including photonic integrated circuits" (California Inventors)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,523,828, issued on Jan. 13, was assigned to Applied Materials Inc. (Santa Clara, Calif.).

"High bandwidth density optical interfaces for co-packaged devices including photonic integrated circuits" was invented by Olufemi I. Dosunmu (San Jose, Calif.), Robert Blum (Mountain View, Calif.), Zijiao Yang (Fremont, Calif.) and Jinxin Fu (Santa Clara, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "An optical interface includes a cladding layer having a plurality of inner cores and a plurality of turning elements formed therein. Each inner core the plurality of inner cores is associated with a respective turning element of the plurality of turning elemen...