US Patent Issued to Applied Materials on Feb. 3 for "Surface topologies of electrostatic substrate support for particle reduction" (California Inventors)

ALEXANDRIA, Va., Feb. 3 -- United States Patent no. 12,542,260, issued on Feb. 3, was assigned to Applied Materials Inc. (Santa Clara, Calif.).

"Surface topologies of electrostatic substrate support for particle reduction" was invented by Arvinder Manmohan Singh Chadha (San Jose, Calif.) and Christopher Beaudry (Santa Clara, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate support for use in a processing chamber to hold a substrate thereon includes a substrate support body, and a plurality of mesas on recessed surfaces of the substrate support body, wherein heights of the plurality of mesas from the recessed surfaces vary over the substrate support body between at least two different heights...