US Patent Issued to Applied Materials on Feb. 3 for "Collimator for a physical vapor deposition (PVD) chamber" (American, Indian Inventors)

ALEXANDRIA, Va., Feb. 3 -- United States Patent no. D1,110,975, issued on Feb. 3, was assigned to Applied Materials Inc. (Santa Clara, Calif.).

"Collimator for a physical vapor deposition (PVD) chamber" was invented by Fuhong Zhang (San Jose, Calif.), Martin Lee Riker (Round Rock, Texas), Suhas Bangalore Umesh (Sunnyvale, Calif.) and Madan Kumar Shimoga Mylarappa (Bengaluru, India).

The patent was filed on July 8, 2024, under Application No. D/951,119.

*For further information, including images, charts and tables, please visit: http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&p=1&u=%2Fnetahtml%2FPTO%2Fsearch-bool.html&r=1&f=G&l=50&co1=AND&d=PTXT&s1=D1110975&OS=D1110975&RS=D1110975

Disclaimer: Curated by HT Syndication....