US Patent Issued to Applied Materials on Feb. 25 for "Reducing aspect ratio dependent etch with direct current bias pulsing" (California Inventors)

ALEXANDRIA, Va., Feb. 26 -- United States Patent no. 12,237,149, issued on Feb. 25, was assigned to Applied Materials Inc. (Santa Clara, Calif.).

"Reducing aspect ratio dependent etch with direct current bias pulsing" was invented by Deyang Li (Santa Clara, Calif.), Sunil Srinivasan (San Jose, Calif.), Yi-Chuan Chou (Santa Clara, Calif.), Shahid Rauf (Pleasanton, Calif.), Kuan-Ting Liu (Santa Clara, Calif.), Jason A. Kenney (Campbell, Calif.), Chung Liu (Foster City, Calif.), Olivier P. Joubert (Santa Clara, Calif.), Shreeram Jyoti Dash (San Jose, Calif.), Aaron Eppler (Santa Clara, Calif.) and Michael Thomas Nichols (Sunnyvale, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments of the present...