ALEXANDRIA, Va., Feb. 26 -- United States Patent no. 12,237,158, issued on Feb. 25, was assigned to Applied Materials Inc. (Santa Clara, Calif.).
"Etch feedback for control of upstream process" was invented by Priyadarshi Panda (Newark, Calif.), Lei Lian (Fremont, Calif.) and Leonard Michael Tedeschi (San Jose, Calif.).
According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate processing system comprises an etch chamber configured to perform an etch process on a substrate, the etch chamber comprising an optical sensor to generate one or more optical measurements of a film on the substrate during and/or after the etch process. The system further comprises a computing device operatively connected to the etch ch...