US Patent Issued to Applied Materials on Feb. 18 for "Processing chamber with multiple plasma units" (California Inventors)

ALEXANDRIA, Va., Feb. 19 -- United States Patent no. 12,230,479, issued on Feb. 18, was assigned to Applied Materials Inc. (Santa Clara, Calif.).

"Processing chamber with multiple plasma units" was invented by Kazuya Daito (Milipitas, Calif.), Yi Xu (San Jose, Calif.), Yu Lei (Belmont, Calif.), Takashi Kuratomi (San Jose, Calif.), Jallepally Ravi (San Ramon, Calif.), Pingyan Lei (San Jose, Calif.) and Dien-Yeh Wu (San Jose, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a processing chamber configured to contain a semiconductor substrate in a processing region of the chamber. The processing chamber includes a remote plasma unit and a direct plasma unit, wherein one of the remote plasma uni...