US Patent Issued to Applied Materials on Feb. 10 for "Use of alternating layer patterns approach for effective overlay metrology in multi-stack die applications" (Singaporean, American Inventors)

ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,547,083, issued on Feb. 10, was assigned to Applied Materials Inc. (Santa Clara, Calif.).

"Use of alternating layer patterns approach for effective overlay metrology in multi-stack die applications" was invented by Yau Loong Chong (Singapore), Venkatakaushik Voleti (San Jose, Calif.), Ruiping Wang (San Jose, Calif.) and Mehdi Vaez-Iravani (Los Gatos, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments of the disclosure include a method for forming a device comprising generating an image of a second die that is bonded on a first die that is bonded on a base substrate, the first die having a first feature formed on a first surface of the fir...