US Patent Issued to Applied Materials on Feb. 10 for "Integrated process flows for hybrid bonding" (Singaporean, American Inventors)

ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,550,662, issued on Feb. 10, was assigned to Applied Materials Inc. (Santa Clara, Calif.).

"Integrated process flows for hybrid bonding" was invented by Ruiping Wang (San Jose, Calif.), Ying Wang (Singapore), Raymond Hung (Palo Alto, Calif.) and Guan Huei See (Singapore).

According to the abstract* released by the U.S. Patent & Trademark Office: "A process flow for bonding a die to a substrate incorporates defectivity risk management and yield promotion by reducing flow complexity. In some embodiments, the process flow may include a radiation process on a component substrate to weaken an adhesive bonding of dies from a surface of the component substrate, a first wet clean process on t...