US Patent Issued to Applied Materials on Feb. 10 for "Apparatus to improve process non-uniformity for semiconductor direct plasma processing" (California Inventors)

ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,548,740, issued on Feb. 10, was assigned to Applied Materials Inc. (Santa Clara, Calif.).

"Apparatus to improve process non-uniformity for semiconductor direct plasma processing" was invented by Edric H. Tong (Sunnyvale, Calif.), Wei Liu (San Jose, Calif.), Victor Calderon (Sunnyvale, Calif.), Rene George (San Carlos, Calif.), Dileep Venkata Sai Vadladi (Sunnyvale, Calif.) and Vladimir Nagorny (Tracy, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments of the present disclosure generally relate to high efficiency inductively coupled plasma sources and plasma processing apparatus. Specifically, embodiments relate to grids to improve plasma ...