US Patent Issued to Applied Materials on Dec. 9 for "Packaging for a sensor and methods of manufacturing thereof" (American, Indian Inventors)

ALEXANDRIA, Va., Dec. 9 -- United States Patent no. 12,492,926, issued on Dec. 9, was assigned to Applied Materials Inc. (Santa Clara, Calif.).

"Packaging for a sensor and methods of manufacturing thereof" was invented by Arvinder Manmohan Singh Chadha (San Jose, Calif.), Ashley M. Okada (San Jose, Calif.), Srikanth Krishnamurthy (Bangalore, India) and Ming Xu (San Jose, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Certain embodiments of the present disclosure relate to a sensor assembly including a substrate, a housing, and a sensor die. In certain embodiments, the substrate includes an outer region, an inner region, and a middle region between the outer region and the inner region. In certain embo...