US Patent Issued to Applied Materials on Dec. 30 for "Soft-chucking scheme for improved backside particle performance" (California Inventors)

ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,512,303, issued on Dec. 30, was assigned to Applied Materials Inc. (Santa Clara, Calif.).

"Soft-chucking scheme for improved backside particle performance" was invented by Tony Jefferson Gnanaprakasa (Mountain View, Calif.), Alvaro Garcia (Mountain View, Calif.), Gautham Bammanahalli (Santa Clara, Calif.), Tatsuichiro Inoue (Santa Clara, Calif.) and Nathaniel Moore (Santa Clara, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments of this disclosure include methods of chucking and de-chucking a substrate. A method of chucking a substrate to a surface of an electrostatic chuck includes applying a first voltage to a chucking electrode in the ...