US Patent Issued to Applied Materials on Dec. 30 for "Reduced substrate process chamber cavity volume" (Indian, American Inventors)

ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,509,756, issued on Dec. 30, was assigned to Applied Materials Inc. (Santa Clara, Calif.).

"Reduced substrate process chamber cavity volume" was invented by Kirankumar Neelasandra Savandaiah (Bangalore, India), Srinivasa Rao Yedla (Bangalore, India), Thomas Brezoczky (Los Gatos, Calif.) and Nitin Bharadwaj Satyavolu (Kakinada, India).

According to the abstract* released by the U.S. Patent & Trademark Office: "Aspects of the present disclosure relate to systems and apparatuses for a substrate processing assembly with a low processing volume. In disclosed embodiments, a processing volume may include a processing space adjacent to a substrate being processed on a substrate support as wel...