US Patent Issued to Applied Materials on Dec. 30 for "Methods and apparatus for wafer detection" (Indian, American Inventors)

ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,512,347, issued on Dec. 30, was assigned to Applied Materials Inc. (Santa Clara, Calif.).

"Methods and apparatus for wafer detection" was invented by Bhaskar Prasad (Adityapur, India), Thomas Brezoczky (Los Gatos, Calif.), Kirankumar Neelasandra Savandaiah (Bangalore, India) and Anubhav Srivastava (Bangalore, India).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments described herein relate to methods and apparatus for detecting and/or monitoring, e.g., abnormalities in wafer transfer and handling. In an embodiment, a method for wafer dechucking verification is provided. The method includes initiating a wafer transfer operation to transfer a wafer...