US Patent Issued to Applied Materials on Dec. 30 for "Electrostatically secured substrate support assembly" (California Inventor)

ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,512,358, issued on Dec. 30, was assigned to Applied Materials Inc. (Santa Clara, Calif.).

"Electrostatically secured substrate support assembly" was invented by Arvinder Manmohan Singh Chadha (San Jose, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate support assembly includes a cooling plate and a chuck disposed on the cooling plate. The chuck includes one or more heating electrodes, and one or more clamp electrodes to electrostatically secure the chuck to the cooling plate. Another substrate support assembly includes a cooling plate, a first puck plate bonded to the cooling plate, and a second puck plate disposed on the first puck pla...