US Patent Issued to Applied Materials on Dec. 2 for "Pulsed plasma (DC/RF) deposition of high quality C films for patterning" (California Inventors)

ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,486,577, issued on Dec. 2, was assigned to Applied Materials Inc. (Santa Clara, Calif.).

"Pulsed plasma (DC/RF) deposition of high quality C films for patterning" was invented by Eswaranand Venkatasubramanian (Santa Clara, Calif.), Yang Yang (Santa Clara, Calif.), Pramit Manna (Santa Clara, Calif.), Kartik Ramaswamy (San Jose, Calif.), Takehito Koshizawa (San Jose, Calif.) and Abhijit B. Mallick (Fremont, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments of the present disclosure relate to methods for depositing an amorphous carbon layer onto a substrate, including over previously formed layers on the substrate, using a plasma-enhanced ch...