US Patent Issued to Applied Materials on Dec. 2 for "Photonic glass layer substrate with embedded optical structures for communicating with an electro optical integrated circuit" (California, Oregon, Arizona Inventors)

ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,487,417, issued on Dec. 2, was assigned to Applied Materials Inc. (Santa Clara, Calif.).

"Photonic glass layer substrate with embedded optical structures for communicating with an electro optical integrated circuit" was invented by Paul Meissner (San Jose, Calif.), Anup Pancholi (Hillsboro, Ore.) and Ronald Huemoeller (Phoenix).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments described herein relate to electronic and photonic integrated circuits and methods for fabricating integrated interconnect between electrical, opto-electrical and photonic devices. One or more optical silicon photonic devices described herein may be used in connection with ...