US Patent Issued to Applied Materials on Aug. 5 for "Package imaging for die location correction in digital lithography" (Taiwanese, American Inventors)

ALEXANDRIA, Va., Aug. 6 -- United States Patent no. 12,379,676, issued on Aug. 5, was assigned to Applied Materials Inc. (Santa Clara, Calif.).

"Package imaging for die location correction in digital lithography" was invented by Ulrich Mueller (Berkeley, Calif.), Hsiu-Jen Wang (Taichung, Taiwan), Shih-Hao Kuo (Hsinchu, Taiwan) and Jang Fung Chen (Cupertino, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Actual physical locations of dies on a substrate package may be identified without using a full metrology scan of the substrate. Instead, one or more cameras may be used to efficiently locate the approximate location of any of the alignment features based on their expected positioning in the design fil...