US Patent Issued to Applied Materials on Aug. 5 for "Multiple substrate handling system and method" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 6 -- United States Patent no. 12,381,103, issued on Aug. 5, was assigned to Applied Materials Inc. (Santa Clara, Calif.).

"Multiple substrate handling system and method" was invented by Hsiu-jen Wang (Taichung, Taiwan), Sin-Yi Jiang (Hsinchu, Taiwan), Neng-rui Dong (Taoyuan, Taiwan), Shih-Hao Kuo (Hsinchu, Taiwan), Chia-Hung Kao (Keelung, Taiwan), Bang-Yu Liu (Taichung, Taiwan) and Hsu-Ming Hsu (Tainan, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure provides a multi-substrate handling system having an alignment apparatus capable of positioning each of a set of substrates in predetermined orientations for transfer. A buffer chamber is configured to receive a...