US Patent Issued to APPLIED MATERIALS on Aug. 26 for "Method of electrostatic chuck motion control for wafer breakage prevention" (American, Japanese Inventors)

ALEXANDRIA, Va., Aug. 26 -- United States Patent no. 12,400,905, issued on Aug. 26, was assigned to APPLIED MATERIALS Inc. (Santa Clara, Calif.).

"Method of electrostatic chuck motion control for wafer breakage prevention" was invented by Junguo Li (Sunnyvale, Calif.), Yosuke Tsumita (Kawasaki, Japan), Andy Der Kae Ma (San Jose, Calif.) and Andrew Eunbeom Choi (Lake Forest, Ill.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Apparatus and methods for lifting a substrate from a substrate support include i. moving the substrate support and the substrate from a first position in a first direction toward lift pins, the substrate support having through holes each of which configured to receive a corresponding lif...