US Patent Issued to APPLIED MATERIALS on Aug. 19 for "Subsurface alignment metrology system for packaging applications" (California Inventors)

ALEXANDRIA, Va., Aug. 20 -- United States Patent no. 12,394,655, issued on Aug. 19, was assigned to APPLIED MATERIALS Inc. (Santa Clara, Calif.).

"Subsurface alignment metrology system for packaging applications" was invented by Venkatakaushik Voleti (San Jose, Calif.), Keith Buckley Wells (Santa Cruz, Calif.) and Mehdi Vaez-Iravani (Los Gatos, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "An apparatus for detecting metrology data in semiconductor packaging processes using fast focus and acquisition techniques to determine alignment metrology data for hybrid bonding. In some embodiments, the apparatus may include a source configured to illuminate a focal point with a wavelength selected from waveleng...