US Patent Issued to Applied Materials on Aug. 19 for "Process chamber manifold" (Indian, American Inventors)

ALEXANDRIA, Va., Aug. 20 -- United States Patent no. D1,089,130, issued on Aug. 19, was assigned to Applied Materials Inc. (Santa Clara, Calif.).

"Process chamber manifold" was invented by Geraldine Vasquez (Santa Clara, Calif.), Shreyas Patil Shanthaveeraswamy (Bangalore, India), Mehran Behdjat (Santa Clara, Calif.), Dien-Yeh Wu (Santa Clara, Calif.), Jallepally Ravi (San Ramon, Calif.), Yu Lei (Belmont, Calif.), Sandesh Yadamane (Bangalore, India), Yi Xu (San Jose, Calif.) and Manjunatha Koppa (Bangalore, India).

The patent was filed on Jan. 19, 2024, under Application No. D/924,552.

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