US Patent Issued to Applied Materials on Aug. 19 for "High throughput polishing modules and modular polishing systems" (California Inventors)

ALEXANDRIA, Va., Aug. 20 -- United States Patent no. 12,394,651, issued on Aug. 19, was assigned to Applied Materials Inc. (Santa Clara, Calif.).

"High throughput polishing modules and modular polishing systems" was invented by Jagan Rangarajan (San Jose, Calif.), Edward Golubovsky (San Jose, Calif.), Jay Gurusamy (Santa Clara, Calif.) and Steven M. Zuniga (Soquel, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments herein include high throughput density chemical mechanical polishing (CMP) modules and customizable modular CMP systems formed thereof. In one embodiment, a polishing module features a carrier support module, a carrier loading station, and a polishing station. The carrier support mo...