US Patent Issued to Applied Materials on Aug. 12 for "Thermal process chamber lid with backside pumping" (California, Arizona Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,387,975, issued on Aug. 12, was assigned to Applied Materials Inc. (Santa Clara, Calif.).

"Thermal process chamber lid with backside pumping" was invented by Anqing Cui (Palo Alto, Calif.), Dien-Yeh Wu (San Jose, Calif.), Wei V. Tang (Santa Clara, Calif.), Yixiong Yang (Fremont, Calif.) and Bo Wang (Chandler, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Process chamber lid assemblies and process chambers comprising same are described. The lid assembly has a housing with a gas dispersion channel in fluid communication with a lid plate. A contoured bottom surface of the lid plate defines a gap to a top surface of a gas distribution plate. A pumpin...