ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,386,264, issued on Aug. 12, was assigned to Applied Materials Inc. (Santa Clara, Calif.).

"Methods to improve process window and resolution for digital lithography with two exposures" was invented by Chi-Ming Tsai (San Jose, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments described herein relate to methods of printing double exposure patterns in a lithography environment. The methods include determining a second exposure pattern to be exposed with a first exposure pattern in a lithography process. The second exposure pattern is determined with a rule-based process flow or a lithography model process flow."

The patent was filed on Sept...