US Patent Issued to Applied Materials on Aug. 12 for "Holistic analysis of multidimensional sensor data for substrate processing equipment" (Singaporean, American Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,386,342, issued on Aug. 12, was assigned to Applied Materials Inc. (Santa Clara, Calif.).

"Holistic analysis of multidimensional sensor data for substrate processing equipment" was invented by Chao Liu (Singapore), Yudong Hao (Fremont, Calif.), Shifang Li (Pleasanton, Calif.) and Andreas Schulze (Campbell, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method includes receiving, by a processing device, first data. The first data includes data from one or more sensors of a processing chamber and is associated with a processing operation. The first data is resolved in at least two dimensions, one of which is time. The method further includes prov...