US Patent Issued to Applied Materials on Aug. 12 for "High connectivity device stacking" (California, New Mexico Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,388,049, issued on Aug. 12, was assigned to Applied Materials Inc. (Santa Clara, Calif.).

"High connectivity device stacking" was invented by Kurtis Leschkies (San Jose, Calif.), Han-Wen Chen (Cupertino, Calif.), Steven Verhaverbeke (San Francisco), Giback Park (San Jose, Calif.), Kyuil Cho (Santa Clara, Calif.), Jeffrey L. Franklin (Albuquerque, N.M.) and Wei-Sheng Lei (San Jose, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure generally relates to stacked miniaturized electronic devices and methods of forming the same. More specifically, embodiments described herein relate to semiconductor device spacers and methods of form...