US Patent Issued to Applied Materials on April 29 for "Wafer edge asymmetry correction using groove in polishing pad" (California Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,285,838, issued on April 29, was assigned to Applied Materials Inc. (Santa Clara, Calif.).

"Wafer edge asymmetry correction using groove in polishing pad" was invented by Jimin Zhang (San Jose, Calif.), Jianshe Tang (San Jose, Calif.), Brian J. Brown (Palo Alto, Calif.), Wei Lu (Fremont, Calif.) and Priscilla Diep LaRosa (San Jose, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A chemical mechanical polishing system includes a platen to hold a polishing pad, a carrier head to hold a substrate against a polishing surface of the polishing pad, and a controller. The polishing pad has a polishing control groove. The carrier is laterally movable by a f...