US Patent Issued to APPLIED MATERIALS on April 22 for "Substrate support for a substrate processing chamber" (American, Japanese Inventors)

ALEXANDRIA, Va., June 6 -- United States Patent no. D1,071,886, issued on April 22, was assigned to APPLIED MATERIALS Inc. (Santa Clara, Calif.).

"Substrate support for a substrate processing chamber" was invented by Zhixiu Liang (Fremont, Calif.), Michael Sterling Jackson (Sunnyvale, Calif.), Jiang Lu (Milpitas, Calif.), Cheng-Hsiung Matthew Tsai (Cupertino, Calif.), Tomoharu Matsushita (Chiba, Japan) and Zubin Huang (Santa Clara, Calif.).

The patent was filed on Jan. 20, 2022, under Application No. D/823,917.

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