US Patent Issued to Applied Materials on April 15 for "Substrate frame design for three-dimensional stacked electronic assemblies and method for the same" (American, Indian Inventors)

ALEXANDRIA, Va., June 5 -- United States Patent no. 12,278,172, issued on April 15, was assigned to Applied Materials Inc. (Santa Clara, Calif.).

"Substrate frame design for three-dimensional stacked electronic assemblies and method for the same" was invented by Akash Agrawal (San Jose, Calif.) and Prashanth Ganeshbaabu (Bengaluru, India).

According to the abstract* released by the U.S. Patent & Trademark Office: "In order to relieve the stress on the substrates in a 3D stacked electronic assembly, a substrate frame is divided into a plurality of frame sections that are separated by spaces between the frame sections. These separations allow the substrates to expand/contract in response to temperature variations and other environmental con...