US Patent Issued to Applied Materials Israel on Sept. 23 for "Shape localization for examining a semiconductor specimen" (Israeli Inventors)

ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,423,798, issued on Sept. 23, was assigned to Applied Materials Israel Ltd. (Rehovot, Israel).

"Shape localization for examining a semiconductor specimen" was invented by Gilad Vered (Giv'at Shmuel, Israel), Dror Alumot (Tel Aviv, Israel), Uri Hadar (Tel Aviv, Israel) and Elran Gamzo (Rosh Haayin, Israel).

According to the abstract* released by the U.S. Patent & Trademark Office: "There is provided a system and method of examining a specimen comprising a first layer and a second layer. The method comprises obtaining a recipe including a template image for each reference polygon in a reference image and a template mask indicative of proximity of a set of locations in the template imag...