US Patent Issued to Applied Materials Israel on May 6 for "Securing a wafer to a chuck" (Israeli Inventors)

ALEXANDRIA, Va., June 10 -- United States Patent no. 12,293,936, issued on May 6, was assigned to Applied Materials Israel Ltd. (Rehovot, Israel).

"Securing a wafer to a chuck" was invented by Dekel Yadid (Rehovot, Israel) and Eytan Hendel (Rehovot, Israel).

According to the abstract* released by the U.S. Patent & Trademark Office: "A system that includes a vacuum module that includes a first vacuum source, a first vacuum propagation path, a second vacuum source, and a second vacuum propagation path. The first vacuum source is configured to provide first vacuum of a first vacuum level, via the first vacuum propagation path, to a chuck. The chuck is mounted on a mechanical stage. The second vacuum source is configured to provide second vac...