US Patent Issued to Apple on Sept. 23 for "Seal ring designs supporting efficient die to die routing" (California Inventors)

ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,424,455, issued on Sept. 23, was assigned to Apple Inc. (Cupertino, Calif.).

"Seal ring designs supporting efficient die to die routing" was invented by Sanjay Dabral (Cupertino, Calif.), Chi Nung Ni (Foster City, Calif.), Long Huang (San Jose, Calif.) and SivaChandra Jangam (Milpitas, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Chip sealing designs to accommodate die-to-die communication are described. In an embodiment, a chip structure includes a split metallic seal structure including a lower metallic seal and an upper metallic seal with overlapping metallization layers, and a through seal interconnect navigating through the split metallic...