US Patent Issued to Apple on Sept. 2 for "Thermal module and joining method for hermetically sealed enclosure of a thermal module using a capillary joint" (California Inventors)

ALEXANDRIA, Va., Sept. 3 -- United States Patent no. 12,408,301, issued on Sept. 2, was assigned to Apple Inc. (Cupertino, Calif.).

"Thermal module and joining method for hermetically sealed enclosure of a thermal module using a capillary joint" was invented by Anthony J. Aiello (Santa Cruz, Calif.), Chetan Harsha Edara (Santa Clara, Calif.) and Pavan Kumar Varma Buddaraju (Milpitas, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A thermal module includes parts with diverging or divergent walls that cause a capillary pressure gradient in a bonding paste used to secure the parts together. Based in part on the capillary pressure, the bonding paste is drawn in between the divergent walls, including small...