US Patent Issued to Apple on Oct. 21 for "Interconnecting a plurality of dies having spare input/output circuit" (California Inventors)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,451,436, issued on Oct. 21, was assigned to Apple Inc. (Cupertino, Calif.).

"Interconnecting a plurality of dies having spare input/output circuit" was invented by Sanjay Dabral (Cupertino, Calif.) and Jun Zhai (Cupertino, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Stitched die structures, and methods for interconnecting die are described. In an embodiment, a stitched die structure includes a semiconductor substrate that includes a first die area of a first die and a second die area of a second die separate from the first die area. A back-end-of-the-line (BEOL) build-up structure spans over the first die area and the second die area, and incl...