US Patent Issued to Apple on Nov. 11 for "Thermally enhanced chip-on-wafer or wafer-on-wafer bonding" (California Inventors)

ALEXANDRIA, Va., Nov. 11 -- United States Patent no. 12,469,765, issued on Nov. 11, was assigned to Apple Inc. (Cupertino, Calif.).

"Thermally enhanced chip-on-wafer or wafer-on-wafer bonding" was invented by Jiongxin Lu (Cupertino, Calif.), Kunzhong Hu (Cupertino, Calif.), Jun Zhai (Cupertino, Calif.) and Sanjay Dabral (Cupertino, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Semiconductor packages including an integrated heat spreader and methods of fabrication are described. In an embodiment, a semiconductor package includes a first package level, a second package level including one or more second-level chiplets, and a heat spreader bonded to the second package level with a metallic layer, which ...