US Patent Issued to Apple on Nov. 11 for "Electronic device enclosure having a molded structure and a porous metallic structure" (California, New York Inventors)

ALEXANDRIA, Va., Nov. 11 -- United States Patent no. 12,470,645, issued on Nov. 11, was assigned to Apple Inc. (Cupertino, Calif.).

"Electronic device enclosure having a molded structure and a porous metallic structure" was invented by Lee E. Hooton (New York) and Alexander W. Williams (Santa Clara, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Electronic devices are disclosed that include metal members bonded to members including a polymer material via a porous metallic layer. The polymer material may at least partially fill and mechanically interlock with pores of the porous metallic layer to form an interlock region."

The patent was filed on July 18, 2023, under Application No. 18/223,337.

*For ...