ALEXANDRIA, Va., March 26 -- United States Patent no. 12,261,132, issued on March 25, was assigned to Apple Inc. (Cupertino, Calif.).
"Structure and method for sealing a silicon IC" was invented by Vidhya Ramachandran (Cupertino, Calif.), Sanjay Dabral (Cupertino, Calif.), SivaChandra Jangam (Milpitas, Calif.), Jun Zhai (Cupertino, Calif.) and Kunzhong Hu (Cupertino, Calif.).
According to the abstract* released by the U.S. Patent & Trademark Office: "Chip sealing structures and methods of manufacture are described. In an embodiment, a chip structure includes a main body area formed of a substrate, a back-end-of-the-line (BEOL) build-up structure spanning over the substrate, and chip edge sidewalls extending from a back surface of the subs...