US Patent Issued to Apple on March 11 for "Multiple chip module trenched lid and low coefficient of thermal expansion stiffener ring" (Taiwanese, American Inventors)

ALEXANDRIA, Va., March 12 -- United States Patent no. 12,249,599, issued on March 11, was assigned to Apple Inc. (Cupertino, Calif.).

"Multiple chip module trenched lid and low coefficient of thermal expansion stiffener ring" was invented by Wei Chen (Union City, Calif.), Jie-Hua Zhao (Cupertino, Calif.), Jun Zhai (Cupertino, Calif.), Po-Hao Chang (Kaohsiung, Taiwan), Hsien-Che Lin (Hsinchu, Taiwan), Ying-Chieh Ke (New Taipei, Taiwan) and Kunzhong Hu (Cupertino, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Multiple chip module (MCM) structures are described. In an embodiment, a module includes a first and second components on the top side of a module substrate, a stiffener structure mounted on the t...