US Patent Issued to Apple on June 3 for "Wafer reconstitution and die-stitching" (California Inventors)

ALEXANDRIA, Va., June 4 -- United States Patent no. 12,322,730, issued on June 3, was assigned to Apple Inc. (Cupertino, Calif.).

"Wafer reconstitution and die-stitching" was invented by Sanjay Dabral (Cupertino, Calif.), Jun Zhai (Cupertino, Calif.), Kwan-Yu Lai (Campbell, Calif.), Kunzhong Hu (Cupertino, Calif.) and Vidhya Ramachandran (Cupertino, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Stitched die packaging techniques and structures are described in which reconstituted chips are formed using wafer reconstitution and die-stitching techniques. In an embodiment, a chip includes a reconstituted chip-level back end of the line (BEOL) build-up structure to connect a die set embedded in an inorgan...