US Patent Issued to Apple on June 3 for "Asymmetric Stackup Structure for SoC package substrates" (American, Taiwanese Inventors)

ALEXANDRIA, Va., June 4 -- United States Patent no. 12,322,721, issued on June 3, was assigned to Apple Inc. (Cupertino, Calif.).

"Asymmetric Stackup Structure for SoC package substrates" was invented by Yikang Deng (San Jose, Calif.), Taegui Kim (San Jose, Calif.), Yifan Kao (Taoyuan, Taiwan) and Jun Chung Hsu (Cupertino, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "An asymmetric stackup structure for an SoC package substrate is disclosed. The package substrate may include a substrate with one or more insulating material layers. A first recess may be formed in an upper surface of the substrate. The recess may be formed down to a conductive layer in the substrate. An integrated passive device may be...