US Patent Issued to Apple on July 29 for "Three-dimensional (3D) copper in printed circuit boards" (California Inventors)

ALEXANDRIA, Va., July 30 -- United States Patent no. 12,376,231, issued on July 29, was assigned to Apple Inc. (Cupertino, Calif.).

"Three-dimensional (3D) copper in printed circuit boards" was invented by Anne M. Mason (Palo Alto, Calif.), Chad O. Simpson (San Jose, Calif.), William Hannon (San Jose, Calif.) and Mark J. Beesley (Carmel Valley, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Structures that implement three-dimensional (3D) conductive material (e.g., copper) in printed circuit boards (PCBs) are disclosed. 3D (three-dimensional) conductive material may include trenches and/or buried vias that are filled with conductive material in the PCBs. Trenches may be formed in build-up layers of a ...