ALEXANDRIA, Va., Dec. 9 -- United States Patent no. 12,493,076, issued on Dec. 9, was assigned to Apple Inc. (Cupertino, Calif.).
"Scan data transfer circuits for multi-die chip testing" was invented by Bo Yang (Santa Clara, Calif.), Heon C. Kim (Campbell, Calif.) and Vasu P. Ganti (Los Altos, Calif.).
According to the abstract* released by the U.S. Patent & Trademark Office: "An apparatus includes a first set of scan-enabled flip-flop circuits may be configured to shift a scan-chain pattern from a first test input node to a first test output node using a first clock signal. A particular lockup latch may be coupled to the first test output node and to a second test input node. This particular lockup latch may be configured to, when enable...