US Patent Issued to Apple on Dec. 9 for "3D system and wafer reconstitution with mid-layer interposer" (California Inventors)

ALEXANDRIA, Va., Dec. 9 -- United States Patent no. 12,494,468, issued on Dec. 9, was assigned to Apple Inc. (Cupertino, Calif.).

"3D system and wafer reconstitution with mid-layer interposer" was invented by Sanjay Dabral (Cupertino, Calif.) and SivaChandra Jangam (Milpitas, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A system in package structure and method of fabrication using wafer reconstitution are described. In an embodiment a 3D system includes a mid-layer interposer a first package level underneath the mid-layer interposer and a second package level over the mid-layer interposer. Second package level components can be bonded to the mid-layer interposer with metal-metal bonds and optionally...